disco corporation equipment for qrindinq of
servicing disco grinding equipment
The Disco DFG8540 System is a fully automatic infeed surface grinder. With its conventional twospindle, threechuck design, the DFG8540 is capable of performing both large diameter and thinfinish grinding. The DFG8540's processing position of the grinding wheel coincides with the chuck table for each spindle for improved grinding performance....
equipment
Process company that designs and manufactures plasma etching and deposition equipment for semiconductor compounds, optoe... Disco Corporation: World wide leader of dicing, grinding, and polishing equipment and consumables for materials such as silicon, glass, cer... DYNAVEST PTE LTD...
Used Industrial Equipment | Used Lab Equipment
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DISCO CORPORATION
DISCO CORPORATION is a Japanbased company engaged in the manufacture and sale of semiconductor manufacturing devices and precision processing tools. The precision processing equipment business manufactures, sells, maintains and provides related services of semiconductor manufacturing equipment, including dicing saws, laser saws, grinders, polishers, surface planer....
6146 Stock Price | Disco Corp. Stock Quote (Japan: Tokyo ...
Disco Corp. The Precision Machines division includes dicing saws, laser saws, grinders, polishers, wafer mounter, die separator, surface planer, and water jet saws. The Precision Processing Tools offers dicing blades, grinding wheels, and dry polishing wheels. The Other Products handles accessory equipment and its related products....
Semiconductor Wafer Polishing and Grinding Equipment ...
Grinding is generally performed for wafer thinning, while polishing ensures a smooth and damagefree surface. However, in most of the latest equipment, the grinding and polishing tasks are integrated into a single device, to overcome the drawbacks of performing these operations separately....
Approach to satisfy the Requirement of Factory Automation
DISCO CONFIDENTIAL –for customers only 2016/03/03 DISCO CORPORATION All rights reserved Approach to satisfy the Requirement of Factory Automation Yuki Takayama ......
Disco Corp () Company Profile |
The precision processing equipment business manufactures, sells, maintains and provides related services of semiconductor manufacturing equipment, including dicing saws, laser saws, grinders ......
About DISCO Corporation Dicing, Grinding
About DISCO Corporation. The rapid development of the semiconductor industry and the digitization of information have advanced the requirements for the abrasive and precision industry. By rapidly adapting to market needs and delivering ondemand technologies, DISCO Corporation has established itself as a market leader in dicing (Kiru),......
Disco Corp Company Profile and News Bloomberg Markets
DISCO CORPORATION manufactures abrasive and precision industrial machinery for cutting and grinding purposes. The Company's products are applied in ....
DISCO Corporation
¤DISCO CORPORATION All rights reserved 3 DISCO HiTec Europe in Munich, Germany Established 1998 85 employees New cleanroom opened ......
Disco Corporation DFL7340 Fully Automatic Laser Saw ...
View all Disco Corporation Equipment. View all listings from this project. View All Equipment at this Location. EquipNet Certified Inspected, Guaranteed, Warranted and Refurbished Equipment. You can rest assured that when you see the EquipNet Certified logo on a listing that you will be buying equipment that has been inspected, tested, and in ......
Dicing Blades | ZHCR Series DISCO Corporation
For relatively thick blades in excess of 60 µm, only the blade tip midsection may wear as the number of cut lines increase. This blade tip shape collapse causes quality deterioration such as widening of the kerf and sporadic chipping....
Polishing Grinding Manufacturers Wafer Production ...
Polishing Grinding Manufacturers Wafer Production Equipment. Disco Japan 4147 Wafer Grinding Equipment, Wafer Polishing M... Dymek Hong Kong Wafer Grinding Equipment, Wafer Polishing M... Genauigkeits Maschinenbau Nürnberg Germany 50 Wafer Grinding Equipment, Wafer Polishing M... GigaMat United States 5,855 Wafer Grinding Equipment,......
DISCO DAG 810 used for sale price #, 2011 > buy ...
Other DISCO equipment; Other WAFER GRINDING, LAPPING POLISHING equipment; NEW TO CAE? Learn about the benefits of buying through CAE. Used DISCO DAG 810 # for sale. This DISCO DAG 810 has been sold....
Disco Back Grinding Machines | Products Suppliers ...
Products/Services for Disco Back Grinding Machines Grinders and Grinding Machines (980 companies) Grinders and grinding machines use an abrasive that is bonded to a wheel, belt or disc to remove material and improve surface finish....
Disco Corp Company Profile and News Bloomberg Markets
DISCO CORPORATION manufactures abrasive and precision industrial machinery for cutting and grinding purposes....
Category:Equipment semiconductor companies Wikipedia
Pages in category "Equipment semiconductor companies" The following 48 pages are in this category, out of 48 total. This list may not reflect recent changes ()....
Rudolph Technologies and DISCO Corporation Partner to ...
Jul 21, 2015· Rudolph Technologies and DISCO Corporation Partner to Improve Wafer Saw Process Rudolph Technologies July 21, 2015 Press Releases 0 Flanders, New Jersey (July 14, 2015)—Rudolph Technologies, Inc. (NYSE: RTEC) and DISCO Corporation of Tokyo, Japan, announce a collaborative partnership to deliver leadingedge hardware and software solutions to optimize the wafer saw unit ....
Disco Corporation DFD6361 Wafer Dicing Saw Listing #711355
View all Disco Corporation Equipment. View all listings from this project. View All Equipment at this Location. EquipNet Certified Inspected, Guaranteed, Warranted and Refurbished Equipment. You can rest assured that when you see the EquipNet Certified logo on a listing that you will be buying equipment that has been inspected, tested, and in ......
Applications Example | Dicing DISCO Corporation
2. 0º (CH3) In CH1, cut lines are cut again in the direction of the red arrows and burring moves in the direction shown in Fig. 3....
Semiconductor Wafer Polishing and Grinding Equipment ...
This consortium focuses on developing and manufacturing the required equipment to process 450 mm wafers. The increase in wafer sizes will be one of the key trends which will gain traction in the semiconductor wafer polishing and grinding equipment market over the forecast period....
Curlie Business: Electronics and Electrical: Components ...
Manufacturer of semiconductor processing equipment including ion implantion, thermal processing, photostabilization, and photoresist dry strip equipment BE Semiconductor Industries NV Designs, develops, manufactures, markets and services molding, trim and form, and selective plating and tinlead plating equipment for the semiconductor industry's backend assembly operations....